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Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore
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Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore

1.852 kr.

1.852 kr.

Tidligere laveste pris:

1.876 kr.

På lager

Man., 21 juli - fre., 25 juli


Sikker betaling

14 dages åbent køb


Sælges og leveres af

Adlibris

Produktbeskrivelse

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.

Varenr.

878659c6-b572-449b-9bb8-bbc6f22fd187

Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore

1.852 kr.

1.852 kr.

Tidligere laveste pris:

1.876 kr.

På lager

Man., 21 juli - fre., 25 juli


Sikker betaling

14 dages åbent køb


Sælges og leveres af

Adlibris